Assembly
Processes
API’s manufacturing equipment includes multiple wafer dicing saws, epoxy and eutectic die attach, manual and automated wire bonders, automated encapsulation equipment, and hermetic sealing machines. Our manufacturing capabilities are augmented by strategic partnerships with external sources for unique packaging options and optoelectronic technologies.
We emphasize a continuous improvement philosophy throughout our workforce and a commitment to capital investments, training and infrastructure development.
- Automated and manual die attach
- Precision die alignment to .0005 inch (.01mm) and one minute of angle
- Automated and manual wire bonding–wedge and ball
- SMT and through-hole configurations
- Submicron fiber alignment