Assembly
Packaging Capabilities
API optoelectronic devices perform everyday around the world in operating environments as diverse as subzero temperatures at construction sites to sub-terrestrial fiber-optic systems in the nose of a laser-guided missile. Each API customer has a unique application utilizing our detector technology, and counts on us to provide a packaging solution that optimizes product performance and reliability. This packaging flexibility includes integrated hybrid electronics, optical filters, reticles and fiber connectors. To effectively serve this diverse range of markets and applications, API provides a variety of packaging choices for our photodiode and LED assemblies:
Substrate package options:
- Flex or rigid PCB; single or multi-layered
- Ceramic substrate; single or multi-layered
- Hermetically sealed
- TO-x style
- Fiber-aligned butterfly packages
- Leadframe (through-hole, SMT, DIP and SIP)
- Flatpack and Lead-less Chip Carrier (LCC)
- Solderable leadwires
- Custom encapsulation
— Filtrode® integrated optical filters
Integrated electronics
Within many of these packaging styles, API provides the option of integrating signal conditioning electronics via hybrid circuit design and assembly. In our telecom products, we incorporate high-speed microwave packaging to optimize device performance.
Contact our sales team today to discuss how API can support your unique packaging requirements.
Navigation
