Assembly
API has over 45,000 square feet of assembly space to support a broad range of assembly techniques, including over 25,000 square feet of environmentally controlled (Class 100,000) assembly space (temperature, humidity, ESD and particulates). Our facilities support turnkey solutions using modern manufacturing techniques. Our scalable processes support both your quick-turn prototype needs and your production requirements from low- to high-volume.
API’s manufacturing equipment includes multiple wafer dicing saws, epoxy and eutectic die attach, manual and automated wire bonders, automated encapsulation equipment, and hermetic sealing machines. In addition, we have full fiber polish and fiber alignment capabilities, as well as hybrid microcircuit assembly. Our manufacturing capabilities are augmented by strategic partnerships with external sources for unique packaging options and optoelectronic technologies.
We emphasize a continuous improvement philosophy throughout our workforce and a commitment to capital investments, training and infrastructure development.